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Citation Information : International Journal on Smart Sensing and Intelligent Systems. Volume 3, Issue 1, Pages 88-93, DOI: https://doi.org/10.21307/ijssis-2017-381
License : (CC BY-NC-ND 4.0)
Published Online: 13-December-2017
In this paper, some design issues of one of the planar-guided media known as Microstrip line has been presented. The main purpose of this paper is to study the fundamental transmission properties of the microstrip line in view of varying the length, materials used for device formation/fabrication and highest frequency of operation. The paper is mainly divided in to two portions; first portion deals with theoretical portion because, it is necessary to know how the characteristic impedance, phase velocity, and attenuation constant of the dominant mode of microstrip depend on geometrical factors, on the electronic properties of substrate and conductors used, and on the frequency. Since this is a “mixed” dielectric system, the TEM mode can not be supported  and the second portion of the investigation was devoted to the effect of variation of length and frequency on the RF performance of the line.
Although many papers are available on this topic, but the issues described in this paper have somewhat
different point of view.
 J.F. Luy, P. Russer, “Silicon-Based Millimeter-wave Devices”, Springer Series in Electronics and Photonics, Springer, Berlin, Germany, 1994.
 T.C. Edwards, Foundations of Microstrip Circuit Design, Weily West Sussex, England, 1992.
 J.F. Luy, K.M. Strohm, H.E. Sasse et al., “Si/SiGe MMIC’s”, IEEE Trans. Microwave Theory and Techniques (1995) 705-714.
 J.Y.C. Chang, A.A. Adibi, M. Gaitan, “Large Suspended inductors on silicon and their use in 2-μm CMOS RF amplifier”, IEEE Electron. Device Letters (1993) 246-248.
 H.S. Gamble, B.M. Armstrong, S.J.N. Mitchell, Y Wu, V.F. Fusco, J.A.C. Stewart, “Low-loss CPW lines on surface stabilized high-resistivity silicon”, IEEE Microwave Guided Wave Letter (1999) 395-397.
 K.T. Chan, A. Chin, S.P. McAlister, et al, “Low RF noise and power Loss for ion-implanted Si having an improved implantation process”, IEEE Electron. Device Letters (2003),28-30.
 K.J. Herrick, T.A. Schwarz, L.P.B. Katehi, “Si-micromachined coplanar waveguide for use in high frequency circuits”, IEEE Trans. Microwave Theory and Techniques (1998) 762-768.
 Y Kwon, H.T. Kim, J.H. Park, Y K. Kim, “Low Loss Micromachned inverted overlay CPW lines with wide impedance ranges and inherent air-bridge connection capability”, IEEE Microwave Wireless Comp. Letter (2001) 56-61.
 G. Six, G. Prigent, G Dambrine, H. Happy, “Fabrication and characterization of low-loss TFMS on silicon substrate up to 220GHz”, IEEE Trans. Microwave Theory and Techniques (2005) 301-305.
 Hung-Wei Wu, Yan-Kuin Su, Ru-Yun Yang, Min-Hang Weng, Yu-Der Lin, “Fabrication of low-loss thin film microstrip line on low resistivity silicon for RF applications”, Elsevier Microelectronics Journal 38 (2007) 304-309.
 Zeland Software incorporation, IE3D Simulator, 2001.