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Citation Information : International Journal on Smart Sensing and Intelligent Systems. Volume 7, Issue 1, Pages 196-213, DOI: https://doi.org/10.21307/ijssis-2017-652
License : (CC BY-NC-ND 4.0)
Received Date : 12-November-2013 / Accepted: 25-February-2014 / Published Online: 27-December-2017
In this study, the detecting structures in an embedded CUP wafer, which are called sensors,are investigated through a contactless sensing analysis. These novel sensing structures, which were designed using the ADS 2009 platform and the design rules for the TSMC 0.18-μm CMOS process, were placed under bonding pads. However, signals would still pass through these I/O sensing structures (i.e., ESD devices or circuits) and become coupled up to the pads of the top-layer metal as square, sinusoidal, or ESD pulse waveforms are injected. Through the resulting sensing relationship, we could then judge whether or not the bottom circuit is a good candidate for EMI consideration. Eventually, it
was found that during an ESD occurred situation, a strong signal coupling can be sensed by the ESD protection circuits, especially by gate-coupled ESD protection circuitry.
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