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VOLUME 7 , ISSUE 5 (December 2014) > List of articles
Special issue ICST 2014
Citation Information : International Journal on Smart Sensing and Intelligent Systems. Volume 7, Issue 5, Pages 1-4, DOI: https://doi.org/10.21307/ijssis-2019-056
License : (CC BY-NC-ND 4.0)
Published Online: 15-February-2020
A non-destructive, non-contact inspection system for packaged integrated circuits using terahertz (THz) radiation is tested. Our results show that we are able to reconstruct the internal structure of the IC, like the microelectronic chip and the interconnections. Due to the limitation of the system and the wavelength of THz radiation the fine bonding wires could not be detected. However, we show that the THz technology will be a valuable tool for the automatic online inspection of packaged integrated circuits.
 Xi-Cheng Zhang, Jingzhou Xu, Introduction to THz Wave Photonics, Springer, New York, 2010
 H.K. Lee, S.I. Yoo, ‘An automated method for inspection of ic bonds,” In Third International Conference on Computational Intelligence and Multimedia Applications, ICCIMA ‘ 99, pages 176-180, 1999
 WanLi Jia, Shi, W., WeiLi Ji, SuGuo Chen, SiFeng Wu, "The conduction current and displacement current in a Terahertz antenna," International Conference on Electronics and Optoelectronics (ICEOE), vol.3, no., pp.V3-291,V3-294, 29-31 July 2011
 P. Karthikeyan, M. Murugappan, S.Yaacob, “ECG Signal Denoising Using Wavelet Thresholding Techniques in Human Stress Assessment,” International Journal on Electrical Engineering and Informatics, vol. 4, num. 2, July 2012
 T. Yasui, T. Yasuda, K. Sawanaka, and T. Araki, "Terahertz paintmeter for noncontact monitoring of thickness and drying progress in paint film," Appl. Opt. 44, 6849-6856 (2005).