The Effect of Residual Stress on Coupling Power Loss of VCSEL Modulus


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International Journal of Advanced Network, Monitoring and Controls

Xi'an Technological University

Subject: Computer Science, Software Engineering


eISSN: 2470-8038





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VOLUME 1 , ISSUE 1 (June 2016) > List of articles

The Effect of Residual Stress on Coupling Power Loss of VCSEL Modulus

Jao-Hwa Kuang / Chao-Ming Hsu / Ah-Der Lin / Jyun-Wei Luo

Keywords : VCSEL, FEM, Creep, residual stresses, misalignment

Citation Information : International Journal of Advanced Network, Monitoring and Controls. Volume 1, Issue 1, Pages 0-0, DOI:

License : (CC BY-NC-ND 4.0)

Published Online: 01-April-2018



In this article,the effect of residual stress on active region misalignmentof laser light sources for vertical cavity surface emitting laser (VCSEL)modulus has been studied.The post-weld-shift variation of active region introduced from the residual stress distribution variation for different VCSELsolder joints, i.e. tin-silver (Sn/3.5Ag) and tin-lead (Sn/37Pb) solder joints,a resimulated by employing the thermal-elastic-plastic finite element model of MARC package.The ball grid solidification in reflow process and the creep deformation in the acceleration aging were simulated and analyze. The time and temperature dependent material properties of solders are employed. Numerical results indicate that the post-weld-shift introduced from residual stress in the solidification process are significant, and are also the key reasons to reduce the coupling efficiency inVCSELpackaging.The non-sequential components models in commercial Zemaxoptical package were used to estimate the optical coupling power loss between the active region and the fibertipin VSCEL modulus.The results show that the proposed post-weld-shift model is feasible to analyze and to improve the solder joint design in the VCSEL packaging.

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